Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan
The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225
Complete Metadata
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|
| description | The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225 |
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| identifier | ark:/88434/mds2-2948 |
| issued | 2023-03-10 |
| keyword |
[
"advanced packaging",
"differential scanning calorimetry",
"filled polymers",
"glass transition",
"heat of reaction",
"semiconductors",
"thermal gravimetric analysis",
"thermosets"
]
|
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|
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| modified | 2023-03-01 00:00:00 |
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[
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|
| theme |
[
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"Chemistry:Chemical engineering and processing",
"Chemistry:Thermochemical properties",
"Materials:Composites",
"Materials:Materials characterization",
"Materials:Polymers"
]
|
| title | Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan |
