Data for "A distributed theory for contactless interconnects at terahertz frequencies"
Included here are figures and other relevant data from the paper "A distributed theory for contactless interconnects at terahertz frequencies". Abstract: Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating the interconnect?s performance. We predict the performance of four distributed contactless interconnects and find good agreement between our multimodal model and 3D simulations up to 1 THz. All the interconnects have less than 1 dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects.
Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| accrualPeriodicity | irregular |
| bureauCode |
[
"006:55"
]
|
| contactPoint |
{
"fn": "Nick Jungwirth",
"hasEmail": "mailto:nicholas.jungwirth@nist.gov"
}
|
| description | Included here are figures and other relevant data from the paper "A distributed theory for contactless interconnects at terahertz frequencies". Abstract: Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating the interconnect?s performance. We predict the performance of four distributed contactless interconnects and find good agreement between our multimodal model and 3D simulations up to 1 THz. All the interconnects have less than 1 dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects. |
| distribution |
[
{
"title": "Figure 1",
"mediaType": "image/tiff",
"description": "(a) 3D design of broadside-coupled CPWs and associated two-port network model of the interconnect. (b) Cross-sectional geometry of the translucent plane in (a). Distributed circuit model in the conductor representation (c) and modal representation (d) for N=2 coupled lines.",
"downloadURL": "https://data.nist.gov/od/ds/mds2-2773/Fig1.tif"
},
{
"title": "Readme",
"mediaType": "text/plain",
"description": "A readme document for data submitted for "A distributed theory for contactless interconnects at terahertz frequencies".",
"downloadURL": "https://data.nist.gov/od/ds/mds2-2773/README.txt"
},
{
"title": "Figure 2",
"mediaType": "image/tiff",
"description": "Conductor-representation distributed circuit parameters of resistance (a), inductance (b), conductance (c) and capacitance (d) per unit length.",
"downloadURL": "https://data.nist.gov/od/ds/mds2-2773/Fig2.tif"
},
{
"title": "Figure 3",
"mediaType": "image/tiff",
"description": "Interconnect transmission (S_12) predicted by full-wave simulations (red curves) and our analytical, parameter-free, two-mode model (dashed curves) for l_c= 500 µm (a), 250 µm (b), 125 µm (c), and 60 µm (d). The transmission band maxima (f_n) and bandwidth (?f_n) increase as the coupling length decreases.",
"downloadURL": "https://data.nist.gov/od/ds/mds2-2773/Fig3.tif"
},
{
"title": "Simulated distributed circuit parameters",
"mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet",
"downloadURL": "https://data.nist.gov/od/ds/mds2-2773/Fig2_Data.xlsx"
},
{
"title": "Scattering parameters of distributed contactless interconnect",
"mediaType": "application/vnd.openxmlformats-officedocument.spreadsheetml.sheet",
"downloadURL": "https://data.nist.gov/od/ds/mds2-2773/Fig3_TableI_Data.xlsx"
}
]
|
| identifier | ark:/88434/mds2-2773 |
| issued | 2023-02-09 |
| keyword |
[
"On-Wafer",
"amplifier",
"electronics",
"frequency comb",
"frequency combiner",
"microwave",
"photomixers",
"terahertz"
]
|
| landingPage | https://data.nist.gov/od/id/mds2-2773 |
| language |
[
"en"
]
|
| license | https://www.nist.gov/open/license |
| modified | 2022-12-15 00:00:00 |
| programCode |
[
"006:045"
]
|
| publisher |
{
"name": "National Institute of Standards and Technology",
"@type": "org:Organization"
}
|
| theme |
[
"Electronics:Electromagnetics",
"Metrology:Electrical/electromagnetic metrology"
]
|
| title | Data for "A distributed theory for contactless interconnects at terahertz frequencies" |
