Patent AT-E399806-T1: [Translated] ONE-COMPONENT THERMOSET EPOXY RESIN COMPOSITION AND BACKING MATERIAL FOR SEMICONDUCTOR ASSEMBLY
The present invention provides an one-pack thermosetting type epoxy resin composition which is useful as an underfilling material used when a flip chip or a semiconductor package comprised of a semiconductor element held on a carrier base being mounted onto a wiring substrate; which can omit a fluxing process as adopted for improvement of the bonding force of bumps or solder balls particularly at said mounting and exhibits a good voidless property even at a reflow temperature; and which can be also applied as an adhesive, a paint, a coating material, a sealing material, or the like. The one-pack thermosetting type epoxy resin composition of the present invention comprises as essential ingredients, a liquid epoxy resin and a carboxylic acid having two or more carboxylic groups in molecule as a curing agent.
Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| bureauCode |
[
"009:25"
]
|
| contactPoint |
{
"fn": "NIH/NCBI Data Team",
"@type": "vcard:Contact",
"hasEmail": "mailto:info@ncbi.nlm.nih.gov"
}
|
| description | The present invention provides an one-pack thermosetting type epoxy resin composition which is useful as an underfilling material used when a flip chip or a semiconductor package comprised of a semiconductor element held on a carrier base being mounted onto a wiring substrate; which can omit a fluxing process as adopted for improvement of the bonding force of bumps or solder balls particularly at said mounting and exhibits a good voidless property even at a reflow temperature; and which can be also applied as an adhesive, a paint, a coating material, a sealing material, or the like. The one-pack thermosetting type epoxy resin composition of the present invention comprises as essential ingredients, a liquid epoxy resin and a carboxylic acid having two or more carboxylic groups in molecule as a curing agent. |
| distribution |
[
{
"@type": "dcat:Distribution",
"title": "Official Data Source",
"mediaType": "text/html",
"description": "Access the complete Patent AT-E399806-T1: [Translated] ONE-COMPONENT THERMOSET EPOXY RESIN COMPOSITION AND BACKING MATERIAL FOR SEMICONDUCTOR ASSEMBLY on the official website.",
"downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E399806-T1"
}
]
|
| identifier | https://healthdata.gov/api/views/q3su-xb3v |
| issued | 2025-09-05 |
| keyword |
[
"chemistry",
"innovation",
"patent",
"pubchem",
"research"
]
|
| landingPage | https://healthdata.gov/d/q3su-xb3v |
| modified | 2025-09-06 |
| programCode |
[
"009:066"
]
|
| publisher |
{
"name": "National Center for Biotechnology Information (NCBI)",
"@type": "org:Organization"
}
|
| theme |
[
"NIH"
]
|
| title | Patent AT-E399806-T1: [Translated] ONE-COMPONENT THERMOSET EPOXY RESIN COMPOSITION AND BACKING MATERIAL FOR SEMICONDUCTOR ASSEMBLY |
