Patent AT-E399830-T1: [Translated] SOLVENT-FREE PRESSURE-SENSITIVE SILICONE ADHESIVES WITH IMPROVED HIGH-TEMPERATURE COHESION
This invention relates to silicone compositions suitable for forining pressure sensitive adhesives. More particularly, the present invention relates to solventless curable PSA compositions suitable for forming pressure sensitive adhesive compositions having improved high temperature cohesive strength while maintaining good tack and adhesive properties.
Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| bureauCode |
[
"009:25"
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|
| contactPoint |
{
"fn": "NIH/NCBI Data Team",
"@type": "vcard:Contact",
"hasEmail": "mailto:info@ncbi.nlm.nih.gov"
}
|
| description | This invention relates to silicone compositions suitable for forining pressure sensitive adhesives. More particularly, the present invention relates to solventless curable PSA compositions suitable for forming pressure sensitive adhesive compositions having improved high temperature cohesive strength while maintaining good tack and adhesive properties. |
| distribution |
[
{
"@type": "dcat:Distribution",
"title": "Official Data Source",
"mediaType": "text/html",
"description": "Access the complete Patent AT-E399830-T1: [Translated] SOLVENT-FREE PRESSURE-SENSITIVE SILICONE ADHESIVES WITH IMPROVED HIGH-TEMPERATURE COHESION on the official website.",
"downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E399830-T1"
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|
| identifier | https://healthdata.gov/api/views/hd86-j6gw |
| issued | 2025-09-05 |
| keyword |
[
"chemistry",
"innovation",
"patent",
"pubchem",
"research"
]
|
| landingPage | https://healthdata.gov/d/hd86-j6gw |
| modified | 2025-09-06 |
| programCode |
[
"009:066"
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|
| publisher |
{
"name": "National Center for Biotechnology Information (NCBI)",
"@type": "org:Organization"
}
|
| theme |
[
"NIH"
]
|
| title | Patent AT-E399830-T1: [Translated] SOLVENT-FREE PRESSURE-SENSITIVE SILICONE ADHESIVES WITH IMPROVED HIGH-TEMPERATURE COHESION |
