Patent AT-E40022-T1: [Translated] COMMON HOUSING FOR TWO SEMICONDUCTOR BODY.
A common housing for two semi-conductor bodies is provided, comprising a front and back section for two spatially separate semi-conductor bodies attached in the housing interior but preferably connected in electrically conductive fashion to one another, whereby the housing surface preferably composed entirely of metal is cooled during operation by a flowable coolant, preferably cooling air. The front, first semi-conductor body is attached in the front section thereof and the back, second semi-conductor body is attached in the back section thereof, the maximum operating temperature of the back semi-conductor body being higher than the maximum operating temperature of the front semi-conductor body, at least at times. The thermal resistance between the front semi-conductor body and a front thermally conductive cooling surface as well as the thermal resistance between the back semi-conductor body and a back thermally conductive cooling surface differing from the front cooling surface, being respectively lower than both the thermal resistance in the housing interior between the two semi-conductor bodies as well as the thermal resistance between the front and the back cooling surface. During operation, the coolant first flows past the front cooling surface and subsequently flows past the back cooling surface.
Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| bureauCode |
[
"009:25"
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{
"fn": "NIH/NCBI Data Team",
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"hasEmail": "mailto:info@ncbi.nlm.nih.gov"
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| description | A common housing for two semi-conductor bodies is provided, comprising a front and back section for two spatially separate semi-conductor bodies attached in the housing interior but preferably connected in electrically conductive fashion to one another, whereby the housing surface preferably composed entirely of metal is cooled during operation by a flowable coolant, preferably cooling air. The front, first semi-conductor body is attached in the front section thereof and the back, second semi-conductor body is attached in the back section thereof, the maximum operating temperature of the back semi-conductor body being higher than the maximum operating temperature of the front semi-conductor body, at least at times. The thermal resistance between the front semi-conductor body and a front thermally conductive cooling surface as well as the thermal resistance between the back semi-conductor body and a back thermally conductive cooling surface differing from the front cooling surface, being respectively lower than both the thermal resistance in the housing interior between the two semi-conductor bodies as well as the thermal resistance between the front and the back cooling surface. During operation, the coolant first flows past the front cooling surface and subsequently flows past the back cooling surface. |
| distribution |
[
{
"@type": "dcat:Distribution",
"title": "Official Data Source",
"mediaType": "text/html",
"description": "Access the complete Patent AT-E40022-T1: [Translated] COMMON HOUSING FOR TWO SEMICONDUCTOR BODY. on the official website.",
"downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E40022-T1"
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|
| identifier | https://healthdata.gov/api/views/qar6-g9vv |
| issued | 2025-09-05 |
| keyword |
[
"chemistry",
"innovation",
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]
|
| landingPage | https://healthdata.gov/d/qar6-g9vv |
| modified | 2025-09-06 |
| programCode |
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|
| publisher |
{
"name": "National Center for Biotechnology Information (NCBI)",
"@type": "org:Organization"
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|
| theme |
[
"NIH"
]
|
| title | Patent AT-E40022-T1: [Translated] COMMON HOUSING FOR TWO SEMICONDUCTOR BODY. |
