Patent AT-E400395-T1: [Translated] SOLDER PASTES
A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5 - 10.0 wt% of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01 - 10.0 wt% of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.
Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| bureauCode |
[
"009:25"
]
|
| contactPoint |
{
"fn": "NIH/NCBI Data Team",
"@type": "vcard:Contact",
"hasEmail": "mailto:info@ncbi.nlm.nih.gov"
}
|
| description | A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5 - 10.0 wt% of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01 - 10.0 wt% of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability. |
| distribution |
[
{
"@type": "dcat:Distribution",
"title": "Official Data Source",
"mediaType": "text/html",
"description": "Access the complete Patent AT-E400395-T1: [Translated] SOLDER PASTES on the official website.",
"downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400395-T1"
}
]
|
| identifier | https://healthdata.gov/api/views/t2aq-9stu |
| issued | 2025-09-05 |
| keyword |
[
"chemistry",
"innovation",
"patent",
"pubchem",
"research"
]
|
| landingPage | https://healthdata.gov/d/t2aq-9stu |
| modified | 2025-09-06 |
| programCode |
[
"009:066"
]
|
| publisher |
{
"name": "National Center for Biotechnology Information (NCBI)",
"@type": "org:Organization"
}
|
| theme |
[
"NIH"
]
|
| title | Patent AT-E400395-T1: [Translated] SOLDER PASTES |
