Patent AT-E400405-T1: [Translated] METHOD FOR PRODUCING A GRINDING ARTICLE
A method of making an abrasive article for wafer planarization, the method comprising providing an abrasive coating composition, providing a backing having a first major surface, said surface having a first portion and a second portion, and bringing the backing into contact with the abrasive coating composition, so that the abrasive coating composition substantially adheres only to the first portion of the backing.
Complete Metadata
| bureauCode |
[ "009:25" ] |
|---|---|
| identifier | https://healthdata.gov/api/views/633e-cr3t |
| issued | 2025-09-05 |
| landingPage | https://healthdata.gov/d/633e-cr3t |
| programCode |
[ "009:066" ] |
| theme |
[ "NIH" ] |
