Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD
A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board.
Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
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"009:25"
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"fn": "NIH/NCBI Data Team",
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|
| description | A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board. |
| distribution |
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{
"@type": "dcat:Distribution",
"title": "Official Data Source",
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"description": "Access the complete Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD on the official website.",
"downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400894-T1"
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|
| identifier | https://healthdata.gov/api/views/iwi2-6cek |
| issued | 2025-09-05 |
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| modified | 2025-09-06 |
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| publisher |
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| theme |
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| title | Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD |
