Patent AT-E401770-T1: [Translated] HEAT DISSIPATION IMPROVEMENTS FOR ELECTRONIC ENCLOSURES
An electronics enclosure is provided. The enclosure includes a cylindrical body, one or more modular card cages adapted to receive one or more electronic circuit cards. The one or more modular card cages including an outer frame member in direct physical and thermal contact with an inner wall of the cylindrical body, an inner frame member, one or more support members coupled between the outer frame member and the inner frame member, and a plurality of electronic device retainers adapted to couple to the modular card cage and hold each of the one or more electronic circuit cards in direct physical and thermal contact with one of the one or more support members. The support members provide an isolated heat dissipation path for heat, produced by each of the one or more electronic circuit cards, to be removed from the enclosure.
Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| bureauCode |
[
"009:25"
]
|
| contactPoint |
{
"fn": "NIH/NCBI Data Team",
"@type": "vcard:Contact",
"hasEmail": "mailto:info@ncbi.nlm.nih.gov"
}
|
| description | An electronics enclosure is provided. The enclosure includes a cylindrical body, one or more modular card cages adapted to receive one or more electronic circuit cards. The one or more modular card cages including an outer frame member in direct physical and thermal contact with an inner wall of the cylindrical body, an inner frame member, one or more support members coupled between the outer frame member and the inner frame member, and a plurality of electronic device retainers adapted to couple to the modular card cage and hold each of the one or more electronic circuit cards in direct physical and thermal contact with one of the one or more support members. The support members provide an isolated heat dissipation path for heat, produced by each of the one or more electronic circuit cards, to be removed from the enclosure. |
| distribution |
[
{
"@type": "dcat:Distribution",
"title": "Official Data Source",
"mediaType": "text/html",
"description": "Access the complete Patent AT-E401770-T1: [Translated] HEAT DISSIPATION IMPROVEMENTS FOR ELECTRONIC ENCLOSURES on the official website.",
"downloadURL": "https://pubchem.ncbi.nlm.nih.gov/patent/AT-E401770-T1"
}
]
|
| identifier | https://healthdata.gov/api/views/vwf5-nce9 |
| issued | 2025-09-05 |
| keyword |
[
"chemistry",
"innovation",
"patent",
"pubchem",
"research"
]
|
| landingPage | https://healthdata.gov/d/vwf5-nce9 |
| modified | 2025-09-06 |
| programCode |
[
"009:066"
]
|
| publisher |
{
"name": "National Center for Biotechnology Information (NCBI)",
"@type": "org:Organization"
}
|
| theme |
[
"NIH"
]
|
| title | Patent AT-E401770-T1: [Translated] HEAT DISSIPATION IMPROVEMENTS FOR ELECTRONIC ENCLOSURES |
