• Organization: National Institute of Standards and Technology
• Updated: 2025-02-10 00:00:00

The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic...

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• Organization: U.S. Environmental Protection Agency
• Updated: 2016-08-10

The data presented in this data file is a product of a journal publication. The dataset contains PCB sorption concentrations on encapsulants, PCB concentrations in the air and in wipe samples,...

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• Organization: National Institute of Standards and Technology
• Updated: 2025-01-30 00:00:00

This repository contains data generated to support and ECTC 2025 conference manuscript titled "Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging...

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• Organization: Department of Energy
• Updated: 2019-06-19T15:05:44Z

Technical papers detailing the development of harsh environment sensors for geothermal applications. Principle Investigator is Prof. Albert P. Pisano (University of California, Berkeley)....

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• Organization: U.S. Department of Health & Human Services
• Updated: 2025-09-06

This invention provides a photovoltaic module for preventing insulation failure between an outer frame and connection leads. The photovoltaic module comprises: a photovoltaic submodule including a...

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• Organization: U.S. Department of Health & Human Services
• Updated: 2025-09-06

A light emitting die package (10) is disclosed. The die package (10) includes a substrate (20), a reflector plate (40), and a lens (50). The substrate (20) is made from thermally conductive but...

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