Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant
The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Texas, May 27 - 30, 2025.
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"hasEmail": "mailto:anthony.kotula@nist.gov"
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|
| description | The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Texas, May 27 - 30, 2025. |
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| issued | 2025-05-15 |
| keyword |
[
"CHIPS metrology",
"advanced packaging",
"cure kinetics",
"microelectronics encapsulation",
"optoelectronics",
"rheology"
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|
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|
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"Chemistry:Thermochemical properties",
"Materials:Composites",
"Materials:Materials characterization",
"Materials:Polymers",
"Metrology:Optical, photometry, and laser metrology"
]
|
| title | Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant |
