• Organization: National Institute of Standards and Technology
• Updated: 2025-02-10 00:00:00

The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic...

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• Organization: National Institute of Standards and Technology
• Updated: 2023-01-30 00:00:00

Thermoset composite structures printed at room temperature using direct ink writing often collapse during thermal post-curing. This behavior suggests that the rheological properties that govern...

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• Organization: National Institute of Standards and Technology
• Updated: 2023-03-01 00:00:00

The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked...

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• Organization: National Institute of Standards and Technology
• Updated: 2025-01-30 00:00:00

This repository contains data generated to support and ECTC 2025 conference manuscript titled "Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging...

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