Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins for material extrusion
Thermoset composite structures printed at room temperature using direct ink writing often collapse during thermal post-curing. This behavior suggests that the rheological properties that govern structural stability (i.e., storage modulus and/or yield stress) are sensitive to both temperature and conversion. The rheo-Raman instrument provides a way to directly link rheological properties, temperature, and conversion. Using this technique, we characterized how the yield stress and storage modulus evolve as a function of conversion at different temperatures and filler contents of fumed silica. This data set focuses on a diglycidyl ether of bisphenol A (DGEBA) epoxy resin (Epon 826, Hexion, Ohio, USA) cured with Jeffamine D-230 (Huntsman Corporation, Texas, USA). Three resins with fumed silica (Cabot Corporation, Massachusetts, USA) mass fractions of 0 %, 5 %, and 10 % were cured and observed isothermally at 70 °C and 100 °C. Rheological and Raman data were obtained, analyzed, and then combined to determine how the yield stress and storage modulus evolve with conversion at different temperatures. These results motivated a two-step schedule designed to prevent a reduction in rheological properties during curing while quickly driving the reaction to high conversion. The two-step schedule began at 70 °C then ramped to 100 °C and is also included in this dataset. This data is described in: Romberg, S.K., & Kotula, A.P. (2023) Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins, National Institute of Standards and Technology, submitted for publication.
Complete Metadata
| @type | dcat:Dataset |
|---|---|
| accessLevel | public |
| accrualPeriodicity | irregular |
| bureauCode |
[
"006:55"
]
|
| contactPoint |
{
"fn": "Stian Romberg",
"hasEmail": "mailto:stian.romberg@nist.gov"
}
|
| description | Thermoset composite structures printed at room temperature using direct ink writing often collapse during thermal post-curing. This behavior suggests that the rheological properties that govern structural stability (i.e., storage modulus and/or yield stress) are sensitive to both temperature and conversion. The rheo-Raman instrument provides a way to directly link rheological properties, temperature, and conversion. Using this technique, we characterized how the yield stress and storage modulus evolve as a function of conversion at different temperatures and filler contents of fumed silica. This data set focuses on a diglycidyl ether of bisphenol A (DGEBA) epoxy resin (Epon 826, Hexion, Ohio, USA) cured with Jeffamine D-230 (Huntsman Corporation, Texas, USA). Three resins with fumed silica (Cabot Corporation, Massachusetts, USA) mass fractions of 0 %, 5 %, and 10 % were cured and observed isothermally at 70 °C and 100 °C. Rheological and Raman data were obtained, analyzed, and then combined to determine how the yield stress and storage modulus evolve with conversion at different temperatures. These results motivated a two-step schedule designed to prevent a reduction in rheological properties during curing while quickly driving the reaction to high conversion. The two-step schedule began at 70 °C then ramped to 100 °C and is also included in this dataset. This data is described in: Romberg, S.K., & Kotula, A.P. (2023) Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins, National Institute of Standards and Technology, submitted for publication. |
| distribution |
[
{
"title": "README",
"format": "text",
"mediaType": "text/plain",
"description": "This text file describes the files in the dataset.",
"downloadURL": "https://data.nist.gov/od/ds/mds2-2918/README.txt"
},
{
"title": "Dataset - Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composites for material extrusion",
"format": "zip",
"mediaType": "application/x-zip-compressed",
"description": "This zip file includes all of the data described in the README file.",
"downloadURL": "https://data.nist.gov/od/ds/mds2-2918/ALL%20DATA.zip"
}
]
|
| identifier | ark:/88434/mds2-2918 |
| issued | 2023-03-07 |
| keyword |
[
"cure kinetics",
"direct ink writing",
"rheo-Raman",
"thermal post-cure",
"thermoset composite",
"yield stress fluid"
]
|
| landingPage | https://data.nist.gov/od/id/mds2-2918 |
| language |
[
"en"
]
|
| license | https://www.nist.gov/open/license |
| modified | 2023-01-30 00:00:00 |
| programCode |
[
"006:045"
]
|
| publisher |
{
"name": "National Institute of Standards and Technology",
"@type": "org:Organization"
}
|
| theme |
[
"Manufacturing",
"Manufacturing:Additive manufacturing",
"Materials",
"Materials:Composites",
"Materials:Polymers",
"Metrology:Flow metrology and rheology",
"Physics:Spectroscopy"
]
|
| title | Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins for material extrusion |
