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Found 1 dataset matching "microelectronics encapsulation".

Federal
Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant
- Organization: National Institute of Standards and Technology
- Updated: 2025-02-10 00:00:00
The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic...
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Search relevance: 65.66 | Views last month: 2

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Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant